The next-generation UCIe physical layer IP, based on TSMC's N4 process, is expected to finalize its design later this year, ...
Kaiserslautern, Germany, January 14, 2025 - Creonic GmbH, the leading provider of cutting-edge communications IP cores, ...
This milestone marks a significant achievement in ensuring seamless integration and reliable data transfer between the two ...
YorChip, Inc. and Chipcraft announce development of a low cost, low power 8 bit 200Ms/s ADC Chiplet. Currently no ultra-low ...
QUALITAS SEMICONDUCTOR, a leading provider of high-speed interconnect solutions, has announced the supply of its 4nm PCIe 6.0 ...
Lonquan 560 SoCs leverage Ceva-SensPro Vision AI DSP to advance ADAS capabilities amidst China's rapidly growing EV market ...
The JESD204C standard enables establishing high-speed serial links between a Controller and ADC and DAC converters. JESD204C ...
This 28nm GPIO is designed for high-speed (>150MHz output, >250MHz input) applications. The IO operates at either 1.8V or 3.3V and can dynamically switch between these voltages during operation. The ...
Body biasing is a disruptive 22FDX® feature which enables the adaption of transistor threshold voltages after production during device operation. Racyics® dense 9T logic standard cells libraries and ...
The Xilinx® Zynq® UltraScale+™ RFSoC family integrates the key subsystems required to implement a complete software-defined radio including direct RF sampling data converters, enabling CPRI and ...
The TRC5024CPA is a four lane Gen 1 and 2 PCI Express Physical layer (Phy) Phy IP core, delivering high-speed serial data transmission over controlled impedance transmission media such as copper cable ...
High-performance for entry-level markets The PowerVR Series8XE family of GPUs drives cost reduction in entry-level and mass market devices thanks to a design that has been optimised to deliver the ...
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