Circuits are being pushed harder and longer, particularly with AI, speeding up the aging of data paths. Photonics adds its ...

Exploiting CPU Cache Side-Channels to Leak Tokens from Large Language Models” was published by researchers at MITRE and Worcester Polytechnic Institute. Abstract “Side-channel attacks on shared ...

A new technical paper titled “Coherent EUV scatterometry of 2D periodic structure profiles with mathematically optimal experimental design” was published by researchers at University of Colorado, NIST ...

A new technical paper titled “Customizing a Large Language Model for VHDL Design of High-Performance Microprocessors” was ...

Chip smuggling prevention; AI export controls and deals; OSAT revenue up; AI PC memory chipsets; big fundings and buybacks; ...

Special report on die-to-die interconnect standards; chiplet development flows; AI accelerators move out from data centers; optimizing analog; UALink; power intent; HBM4.

Chiplets will be a key enabler for customizing designs at every level, from edge devices to the cloud. AI is a key driver, ...

They depend on careful coordination between RTL, verification and implementation teams. And here’s where things get tricky. Without a consis­tent way to describe and validate power intent across the ...

Two standards — Bunch of Wires (BoW) and UCIe — compete with proprietary designs. Today, the latter predominates, since ...

Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has ...