Silicon Creations, a leading provider of high-performance analog and mixed-signal intellectual property (IP), today announced the successful tape-out of a TSMC N2P chip including a novel temperature ...

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

President Donald Trump has stated that he plans to impose tariffs as high as 100% on semiconductors made outside the U.S.

Will Trump scrap the incentives offered to foreign firms like TSMC under the CHIPS Act – while upping the pressure for Taiwan ...

On January 22, 2025, a magnitude 6.4 earthquake occurred in Dapu Township, Chiayi County, Taiwan. The epicenter was 9.4 km deep, and the earthquake recorded a seismic intensity of 5 in the ...

"N2 wafers take ~14 weeks to be fabricated across ... the Apple iPhone 15 Pro went on sale in September 2023 with N3 silicon and TSMC has since introduced two further derivations of its 3nm ...

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Nvidia CEO Jensen Huang confirms changes in advanced packaging needs at TSMC, opting for CoWoS-L over CoWoS-S for upcoming ...

Nvidia Corp’s demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) remains strong though the ...

Blackwell, Nvidia's latest artificial intelligence chip, utilizes chip-on-a-wafer substrate ... newer tech produced by TSMC. It incorporates active components in the silicon interposer, which ...

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.